Qualcomm Unveils Snapdragon X2 Plus Chipset with Enhanced AI Performance and Efficiency

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Key Takeaways
- Snapdragon X2 Plus offers up to 80 TOPS NPU performance, a 43% leap in power efficiency
- Two variants: 10-core (X2P-64-100) and 6-core (X2P-42-100), built on 3nm process
- Expected in laptops from late March 2026, starting around USD 800
Qualcomm has debuted the Snapdragon X2 Plus during CES 2026, launching two variants: a 10-core model (X2P-64-100) and a 6-core model (X2P-42-100). Both chips are fabricated using a cutting-edge 3nm process, with devices powered by this platform anticipated to arrive in market by late March 2026.
The 10-core version packs six prime cores clocked at a maximum of 4.0GHz for multi-core tasks, complemented by four performance cores running at 3.4GHz, totaling 34MB of cache. The 6-core variant omits the performance cores, focusing solely on its six prime cores. Both variants utilize Qualcomm's 3rd-generation Oryon CPU architecture, delivering up to 35% higher single-core performance and multi-core gains of up to 17% for the 10-core model and up to 10% for the 6-core model, according to Geekbench 6.5 benchmarks.
Graphics capabilities are handled by the Adreno X2-45 GPU, running at 1.7GHz for the 10-core variant and 0.9GHz for the 6-core variant. This GPU supports modern graphics APIs and features, including DX12 Ultimate, Vulkan 1.4, OpenCL 3.0, Adreno High Performance Memory, and enhanced ray tracing.
In the AI domain, the Snapdragon X2 Plus boasts what Qualcomm claims is the world's fastest NPU platform for laptops, delivering up to 80 TOPS of AI compute—a substantial increase from the previous X Plus generation's 45 TOPS.
Memory support reaches up to 128GB of LPDDR5X, running at speeds up to 9523 MT/s across a 128-bit bus, providing up to 152 GB/s bandwidth—an upgrade from the prior generation's 8448 MT/s. The integrated Snapdragon X75 5G modem enables peak speeds of up to 10Gbps for downloads and 3.5Gbps for uploads. Additional connectivity includes Wi-Fi 7, Bluetooth 5.4, optional 5G support, and up to three USB-C ports. The chipset also supports driving up to three 4K 144Hz display panels simultaneously.
Security features incorporate the Qualcomm SPU with Microsoft Pluton integration, offering biometric authentication, automatic presence detection, and chip-to-cloud protection. Optional Snapdragon Guardian Technology provides enterprise-grade security, alongside Out-of-Band remote manageability for maintenance and updates.
First laptops featuring the Snapdragon X2 Plus are expected to hit shelves in the first half of 2026, with devices likely to start around USD 800.
Key specs
| Wireless | Wi-Fi 7 (FastConnect 7800), Bluetooth 5.4 |
| NPU | Qualcomm Hexagon NPU, 80 TOPS |
| Price | USD 800 (expected starting price) |
| Memory | LPDDR5X up to 9523 MT/s, up to 128 GB capacity |
| 5G Modem | Snapdragon X75 5G Modem-RF System, up to 10Gbps download / 3.5Gbps upload |
| CPU | 3rd-generation Qualcomm Oryon, 10-core (X2P-64-100) or 6-core (X2P-42-100), up to 4.0 GHz |
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