Google Shifts Tensor G5 Production to TSMC Starting With Pixel 10 in Late 2025

Google has announced a significant shift in its chip manufacturing strategy, moving production of the Tensor G5 to TSMC, effective with the upcoming Pixel 10 lineup later this year. The move ends the current partnership with Samsung Foundry and marks the first time TSMC will handle Tensor chip fabrication. Google has secured a commitment spanning 3 to 5 years, which could see the chip used through the Pixel 14 series.

The Tensor G5 will be built using TSMC’s N3E process and employ InFO-POP packaging technology. It adopts a 1+5+2 CPU configuration, consisting of one high-performance Cortex-X4 core, five Cortex-A725 cores and two energy-efficient Cortex-A520 cores. The chip will integrate 16GB of PoP RAM supplied by Samsung Electronics.

Google has brought several components in-house or sourced them from new partners. The image signal processor will be designed internally, while display controllers come from VeriSilicon, video codecs from Chips&Media and modems from MediaTek. The chip includes a custom Tensor Processing Unit optimized for on-device machine learning tasks such as voice typing and photo processing.

Looking ahead, Google may follow the G5 with a Tensor G6 built on TSMC’s next-generation 2nm process, potentially appearing with the Pixel 11 in 2026. Availability of devices using the Tensor G5 in Nepal will be determined by the official launch timing of the Pixel 10 series.